Каталог Sumitomo сплавы и режимы - страница 32

Polycrystalline Diamond

SUMIDIA Binderless Series

SUMIDIA Binderless Series uses nano-polycrystalline diamond for the cutting edge and demonstrates

excellent wear and fracture resistance compared to conventional sintered diamond tools.

In particular, SUMIDIA Binderless Series allows for improvements in tool life and machining precision

A that go far beyond conventional diamond tools in the machining of hard brittle materials, such as carbide.

• Excellent for High Precision Machining of Carbide Nano-polycrystalline diamond with excellent wear resistance achieves high precision machining of carbide.
• Maintains Superior Dimensional Tolerances Over Many Hours Greatly reduces the number of tool replacements compared to conventional diamond tools, and increases work efficiency while reducing total costs.
• Suitable for Hard Brittle Material Machining Hard brittle materials (such as ceramics) that could only be ground before can now be cut.

Characteristics

• Comparison of Structures
• Hardness

Nano-Polycrystalline Diamond Conventional PCD SEM Structure SEM Structure Nano-Polycrystalline No anisotropy and ultra-hard Diamond Binder (Co)

Single-crystal Diamond Hardness depends on face orientation

Conventional PCD Load 4.9N

100nm 5μｍ 0 50 100 150

Knoop Hardness HK(GPa) Diamond Particles Diamond Particles (30 to 50nm) (1 to 10μm)

• Application (Carbide Machining) 1. Hardness Less Than 88HRA 2. Hardness 88HRA and Greater

0.20 0.20

0.15 0.15

0.10 0.10

a p ap 0.05 0.05 (mm) (mm)

0 0.05 0.10 0.15 0.20 0 0.05 0.10 0.15 0.20

Feed Rate f (mm/rev) Feed Rate f (mm/rev)

• Recommended Cutting Conditions (Carbide Machining)

Grade Range Map From page A33

Characteristic Values From page A33