Каталог Sumitomo пластины с алмазными вставками Sumidia - страница 43

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SUMIDIA Binderless Endmill Series

■ General Features SUMIDIA Binderless is a type of polycrystalline diamond, produced by directly sintering nano-order diamond grains without using any binders. SUMIDIA Binderless is harder than single-crystal diamond and has no cleavability. Therefore, it enables machining of hard, brittle materials such as carbides and enables new machining methods.

■ Characteristics

  • Best suited for finishing of brittle materials such as carbide Achieving excellent machined surface quality with a sharp cutting edge and optimized cutting edge preparation.
  • Achieves high precision machining and long tool life Maintains excellent dimension accuracy over long periods of time with high contour accuracy of the cutting edge and high wear resistance of the diamond.

SUMIDIA Binderless Radius Endmills SUMIDIA Binderless Ballnose Endmills

NPDRSNPDRSRadiusrNPDBSNPDBS / / NPDBNPDBBall
R

Type Type Type Type Type Type

For Machining Side Surfaces/Bottom Radii For Machining Ballnose Shapes

  • Pocket Machining
  • Application To Medical Use (µ-TAS Mold)

M

1mm

SUMIDIA

Work material:Carbide AF1 (ultra fine grain alloy)Work material:SUMIDIA Binderless Carbide AF1 (ultra fine grain alloy)
Finishing tool:NPDRS1100R005-030Finishing tool:SUMICRYSTAL NPDB1030-010 (R0.3)
Machining conditions: 10mm × 10 mm × Depth 2 mmCutting conditions: n = 38,000 min
-1, v = 95 mm/min
f
Cutting conditions:n = 40,000 min-1, v = 200 mm/minp = 0.001 mm, Wet (oil)
ff
p = 0.005 mm, oil mistFinishing allowance: 0.003 mm
f
Surface roughness: Ra 0.015 μmSurface roughness: Ra 0.016–0.020 μm
Machining time:2 hoursMachining distance: 8.3 m

Machining time: Finishing 1 hour 28 minutes