
Mold Finish Master
SUMIDIA Binderless Endmill Series
■ General Features
SUMIDIA Binderless is a type of polycrystalline diamond,
produced by directly sintering nano-order diamond grains
without using any binders.
SUMIDIA Binderless is harder than single-crystal diamond
and has no cleavability. Therefore, it enables machining of
hard, brittle materials such as carbides and enables new
machining methods.
■ Characteristics
● Best suited for finishing of brittle materials such as carbide
Achieving excellent machined surface quality with a sharp cutting edge and optimized cutting edge preparation.
● Achieves high precision machining and long tool life
Maintains excellent dimension accuracy over long periods of time with high contour accuracy of the cutting edge and high
wear resistance of the diamond.
SUMIDIA Binderless Radius Endmills SUMIDIA Binderless Ballnose Endmills
Radius Ball
NPDRS Type r NPDBS Type / NPDB Type R
For Machining Side Surfaces/Bottom Radii For Machining Ballnose Shapes
● Pocket Machining ● Application To Medical Use (µ-TAS Mold)
M
SUMIDIA
1mm
SUMIDIA
SUMIDIA Binderless
Work material: Carbide AF1 (ultra fine grain alloy) Work material: Carbide AF1 (ultra fine grain alloy)
Finishing tool: NPDRS1100R005-030 Finishing tool: NPDB1030-010 (R0.3) SUMICRYSTAL
Machining conditions: 10mm × 10 mm × Depth 2 mm Cutting conditions: n = 38,000 min-1, vf = 95 mm/min
Cutting conditions: n = 40,000 min-1, vf = 200 mm/min pf = 0.001 mm, Wet (oil)
pf = 0.005 mm, oil mist Finishing allowance: 0.003 mm
Surface roughness: Ra 0.015 μm Surface roughness: Ra 0.016–0.020 μm
Machining time: 2 hours Machining distance: 8.3 m
Machining time: Finishing 1 hour 28 minutes
M43