
Polycrystalline Diamond Tools
SUMIDIA Series
■ Application Range ■ Recommended Cutting Conditions
● Aluminum
Cutting speed Feed rate Depth of cut
Turning Work material
Machinability Work material
Roughing Finishing
Milling Example part vc (m/min) f (mm/rev) ap (mm)
Good up to up to
DA1000 Aluminum alloy up to 3
Sintered aluminum Cylinder liner 3,000 0.2
up to up to
DA2200 Copper alloy up to 3
1,000 0.2
Transmission case, up to up to
Die cast aluminum oil pan cylinder block, Reinforced plastic up to 2
(ADC12) aluminum wheel, HDD 1,000 0.4
Wood, inorganic board up to up to
Q
(Cutting, etc.) 4,000 0.4
Low silicon
(AC2B-T6,AC4C-T6)
Cylinder head up to up to
Carbide 10 to 30
DA150 0.2 0.5
100 to
Carbon 1 up to 2
High silicon (T6) 600
Cylinder block
Difficult
● Non-aluminum
Turning
Machinability Work material Milling Example part
Roughing Finishing
Good
Non-ferrous DA1000
sintered alloy Bushing
DA2200
Gunmetal carbon Connecting rod
DA90 NPD10
Carbide Punches, dies, rolls
DA90 DA150
Iron combined Cylinder block, bearing cap
Difficult
■ SUMIDIA Grinding Method
Category Detail
(1) It is desirable to use a specialized high rigidity grinder.
Grinder Q
(2) Wet grinding must be used.
Abrasive grain Diamond
Grain size Rough grinding: 400 mesh Finish grinding: 800 to 1,500 mesh
Griding
Bond Vitrified, or metal bond specialized for polycrystalline diamond tools
Wheel
Concentration 100 to 125
Dressing Dress with a stick that is approximately 400 mesh WA
Peripheral Speed 800 to 1,000 m/min
Grinding
Table Rocking 30 to 60 rev/min
conditions
Grinding fluid Water soluble grinding fluid (solution type)
Other Q
(1) The rake surface is generally lapped.
(2) Inspect for edge chipping using a microscope with a magnification of 30 to 50 times.
M
SUMIDIA
(3) Machining of non-ferrous metals require a sharp cutting edge.
(4) Surfaces that were cut by EDM should have more than 0.05mm ground off.
Note: Contact us for re-grinding NPD10.
SUMIDIA
SUMIDIA Binderless
SUMICRYSTAL
M3