
proprietary technologies.
and the combination of binder materials.
product line.
aluminum alloys to brittle materials such as carbide.
Average Size of Hardness HV TRS
Grade Features Applications diamond Grains
(μm) (GPa) (GPa)
A 100% diamond grade made by nano-
level diamond grains with direct conversion Surface finishing of carbide
NPD10 sintering. Has the highest wear resistance Machining brittle materials (ceramics) up to 0.05 to ≈ 3.15
and fracture resistance, and the best edge 130 sharpness.
Made by sintering super fine-grained Rough machining / interrupted machining / surface 110
DA1000 diamond at high densities. Has excellent finishing of aluminum alloys up to 0.5 to ≈ 2.60
wear resistance, fracture resistance, and Woodworking, cutting / face machining of wood and
edge sharpness. wooden boards
Made by sintering super fine-grained Rough machining / interrupted machining / surface 90
DA2200 diamond. Has a good balance of wear finishing of aluminum alloys 0.5 to ≈ 2.45
resistance and fracture resistance, and has Woodworking, cutting / face machining of wood and
excellent edge sharpness. wooden boards
A grade made by sintering fine-grained 100
Surface finishing of pre-sintered ceramic parts and
DA150 diamond. Diamond grains are firmly joined 5 to ≈ 1.95
stamped parts together. Has an excellent balance of Machining FRP, hard rubber, and carbon 120 machinability and wear resistance. Cutting/face machining of wooden and inorganic boards
A grade made by sintering rough-grained Rough machining of carbide, pre-sintered ceramic parts,
DA90 diamond. Contains the highest amount of up to 50 to ≈ 1.10
and stamped parts.
diamond. Has excellent wear resistance. Machining of sintered ceramic parts, machining of stone / 120
rock
Al-25% Si alloy continuous cut test results MMC (Al-20% SiC) continuous cut test results Carbide (87HRA) continuous cut test results
0.15 0.3 Competitor 0.10
VB=0.171mm
M Competitor B 0.10 DA150 0.2
DA150 DA90 0.05 DA90 Competitor A
DA90 0.05 0.1
DA1000 VB=0.034mm NPD10
0 10 20 30 40 0 0
SUMIDIA 1 2 3 4 100 200 300 400
SUMIDIA Binderless
Cutting distance (km) Cutting distance (km) Cutting distance (km)
SUMICRYSTAL
| Work material: Al-25% Si alloy | Work material: MMC (Al-20% SiC) | Work material: Carbide (87HRA) |
| Insert: SPGN120304 | Insert: CNMX120408 | Insert: DCMW11T304RH |
| Holder: FP11R | Holder: PCLN2525 | Holder: SDJC2020 |
| Cutting conditions: v = 500 m/min, f = 0.1 mm/rev, | Cutting conditions: v = 350 m/min, f = 0.2 mm/rev, | Cutting conditions: v = 20 m/min, f = 0.1 mm/rev, |
| c | c | c |
| a = 0.2 mm, Dry | a = 0.18 mm, Wet | a = 0.1 mm, Dry |
| p | p | p |