Milling Cutting force (N) Cutting force (N) Lead angle 0°/ 2° MEW Double-sided 4-edge insert MEW Kyocera's unique mold technology reduces cuttingA.Rf.oMracxe.+e10q°uivalent to positive inserts (LOMU 15 type) A.R. Max .+10° (LOMU 15 type) Obtuse edge increases Obtuse edge increases Cutting edge cutting edge toughness Cutting edge cutting edge toughness Obtuse ed angle 90˚ angle 90˚ Cutting edge cutting ed angle 90˚ 90° 90° 90° Cutting edge Cutting edge Obtuse edge ue mold technology Unique mold technology ositive inserts Fracture resistance comparison (Internal evaluation) Unique mold technologynd the feed force.High stability at high feed ratesLow cutting force equivalent to posiOtbitvusee eidngesertsCutting force comparison(Internal evaluation)Fracture resistance co * Cutting force is the resultant force of the principal force and the feed force. ositive inserts LowGMccMhuiEpbWtretaikner g force equivalent to Availablefor furthermachining positive inserts 2,0001,800 MEWEquivalent to positive insertsGM chipbreaker M 98%Competitor C(Positive)CuCtotminpegtitfoor Drce comparison (Internal evaluation) Fracture fz (mm/t)(Negative)* Cutting force is the resultant force of the principal force and the feed force.2,0Co0m0petitor E(Negative)0.30Fracture0.351,80001020304050Equivalent to positive inserts1,600Cutting time (min)1,400 Vc=120m/min apxae=3x10mm fz=0.3~0.35mm/tSCM440H (37~39HS) Cutting dia. ø20Fracture r1e,6s00istance comparison(Internal evaluation)1,400High stability at high feed ratesCompetitor D(Negative)ME11W,,020000127%GM chipb8r0e0aker109%100%98%Available forCompetitor Efurther machining(Negative)Competitor ACompetitor BMEWCompetitor C0(Negative)(Negative)GM chipbreaker(Positive)ComFracturefz (mm/t)Vc=120m/minapxae=3x10m(NegVact=i1v50em)/minapxae=3x15mm fz=0.15mm/t S50CCutting dia. ø20SCM440H (37~39HS) Cuttin 1,200ing chattering1,000127M%EW Co1m09p%etitor F Com1p0e0t%itor GGM chipbreaker(Negative)(Positive)98% C(NoeImgmaptipveetr)iotovreEd surface finishF,ramctiunriemizing 0.30 chatte0r.i3n5g MEGM chip attering and burrs 800al rake designCompet+ito2r0A° Comp+e1tit7o°r B M+1E7W° Competitor C Swhitahrpheculicttailncgu0attnindgs1ue0pdegreio2ar0nrdesoisp3tt0ainmcuem4to0acxhiaal5trt0aekriendgeasnigdnburrs +2 (NLearggaetaivcteu)al rake a(nNgeleglaotwiveers) cuttingGMforccheipbreaker (Positive) Cutting time (min) Large act n with positive cutters (Internal evaluation) Vc=S1u20rmfa/cmeinoafpsxhaeo=u3lxd1e0mr wm afzll=0.3~(0In.t3e5rnmalmev/taluation) Burr comparison with Vc=150m/min apxae=3x15mm fz=0.15mm/t S50C Cutting dia. ø20 SCM440H (37~39HS) Cutting dia. ø20 rHtter) MEW Competitor I(Positive cutter) MEW Competitor H(Positive cutter) MEW Improved surface finish, minimizing chattering MEW Competitor F Competitor G Burrs GM chipbreaker (Negative) (Positive) Sharp cutting and superior resistance to chattering and burrs with helical cutting edge and optimum axial rake design +20° +17° +17° Large actual rake angle lowers cutting force SurfaceShoarfpschutotinugledneabrlews laeslslburrs (tIhnatenrpnoalsietvivaelucauttitoenr)s Burr comparisoSmnoowthitsuhrfapceoosfiMtiEvWewcithuotuttechrasttering (Internal evaluation) Sharp cutting en a. ø20 Vc=250m/min apxae=4x5mm fz=0.1mm/t Dry S50C Cutting dia. ø20MEW Competitor H(Positive cutter) Vc=240m/min apxae= 4 (3passes) x5mm fz=0.12mm/t Dry SS400 Cutting dia. ø20 Vc=250m/min apxae=4x5mm fz=0.1MEWCompetitor I(Positive cutter) Burrs Smooth surface of MEW without chattering Sharp cutting enables less burrs than positive cutters Vc=240m/min apxae= 4 (3passes) x5mm fz=0.12mm/t Dry SS400 Cutting dia. ø20 Vc=250m/min apxae=4x5mm fz=0.1mm/t Dry S50C Cutting dia. ø20 M36