Основной каталог Kyocera 2021 - 2022 - страница 674

High efficiency modular drillDRA

Magic Drill

Excellent hole accuracy with a low cutting force design

5 advantages to solve common drilling difficulties

1 Low cutting force design improves 2 Optimal web thickness reduces

hole accuracy deflection Special chisel edge with S-curve reduces thrust force Improved hole accuracy by controlling drill deflection and reduces vibration. with a 20% thicker web compared with Competitor A. Cutting edge Web thickness

comparison

20%

DRA Standard drill DRA Competitor A

KK Cutting force comparison (Internal evaluation) Roundness Cylindricity comparison (Internal evaluation)

4,000 DRA (GM) Competitor D Competitor E

35 3,496 3,000 % 2,888 2,000 2,265

1,000

DRA (GM) Competitor B Competitor C

Cutting conditions: Vc = 120 m/min, f = 0.25 mm/rev Cutting conditions: Vc = 120 m/min, f = 0.3 mm/rev Drilling diameter ø14, L/D = 5, drilling depth 45 mm, wet, workpiece: C50 Drilling diameter ø14, L/D = 5, measurement position 55 mm, wet, workpiece: C50 3 Fine chip breaking even in deep hole drilling applications Optimized web thinning for stable chip evacuation.

Support groove with wider flute (5D, 8D) enables smooth chip evacuation.

Chip comparison

(Internal evaluation)

5D holder

(First chip)

DRA (GM) Competitor F Competitor G Support groove

Cutting conditions: Vc = 60 m/min, f = 0.2 mm/rev, drilling diameter ø14, L/D = 5 (Assist chip evacuation) Drilling depth 70 mm, wet, workpiece: X5CrNi1810