Polycrystalline Diamond Tools SUMIDIA Series ■ Application Range ■ Recommended Cutting Conditions ● Aluminum Cutting speed Feed rate Depth of cut Machinability Work material Turning Milling Example part Work material vc (m/min) f (mm/rev) ap (mm) Roughing Finishing Good up to up to up to 3 DA1000 Aluminum alloy 3,000 0.2 Sintered aluminum Cylinder liner Copper alloy up to up to up to 3 DA2200 1,000 0.2 Transmission case, up to up to Die cast aluminum oil pan cylinder block, Reinforced plastic 1,000 0.4 up to 2 (ADC12) aluminum wheel, HDD Wood, inorganic board up to up to Q (Cutting, etc.) 4,000 0.4 Low silicon Cylinder head up to up to (AC2B-T6,AC4C-T6) Carbide 10 to 30 DA150 0.2 0.5 Carbon 100 to 1 up to 2 High silicon (T6) 600 Cylinder block Difficult ● Non-aluminum Machinability Work material Turning Milling Example part Roughing Finishing Good Non-ferrous DA1000 sintered alloy Bushing DA2200 Gunmetal carbon Connecting rod DA90 NPD10 Carbide Punches, dies, rolls Iron combined DA90 DA150 Cylinder block, bearing cap Difficult ■ SUMIDIA Grinding Method Category Detail Grinder Q (1) It is desirable to use a specialized high rigidity grinder. (2) Wet grinding must be used. Abrasive grain Diamond Grain size Rough grinding: 400 mesh Finish grinding: 800 to 1,500 mesh Griding Bond Vitrified, or metal bond specialized for polycrystalline diamond tools Wheel Concentration 100 to 125 Dressing Dress with a stick that is approximately 400 mesh WA Peripheral Speed 800 to 1,000 m/min Grinding Table Rocking 30 to 60 rev/min conditions Grinding fluid Water soluble grinding fluid (solution type) M (1) The rake surface is generally lapped. Other Q (2) Inspect for edge chipping using a microscope with a magnification of 30 to 50 times. (3) Machining of non-ferrous metals require a sharp cutting edge. SUMIDIA (4) Surfaces that were cut by EDM should have more than 0.05mm ground off. Note: Contact us for re-grinding NPD10. SUMIDIA SUMIDIA Binderless SUMICRYSTAL M3