Общий каталог Sumitomo 2018 - 2019 - страница 35

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Grades ut ap (mm)Depth of C Depth of Cut ap (mm) PCD (Polycrystalline Diamond) SUMIDIA Binderless New SUMIDIA Binderless Series uses nano-polycrystalline diamond for the cutting edge and demonstrates excellent wear and fracture resistance compared to conventional sintered diamond tools. In particular, SUMIDIA Binderless Series allows for improvements in tool life and machining precision that go far beyond conventional diamond tools in the machining of hard brittle materials, such as carbide. Excellent for High Precision Machining of Carbide Nano-polycrystalline diamond with excellent wear resistance achieves high precision machining of carbide. Maintains Superior Dimensional Tolerances Over Many Hours Greatly reduces the number of tool replacemets compared to conventional diamond tools and increases work efficiency while reducing total costs. Suitable for Hard Brittle Material Machining Hard brittle materials (such as ceramics) that could only be ground before can now be cut. Characteristics Comparison of Structure Hardness Nano-Polycrystalline Diamond Conventional PCD SEM Structure SEM Structure Nano-Polycrystalline Diamond No anisotropy and ultra-hard Single-crystal Diamond Hardness depends on face orientation Conventional PCD Load 4,9N 0 50 100 150 Diamond Particles Diamond Particles Knoop Hardness (GPa) (30 ~ 50nm) (1 ~ 10μm) Application (Carbide Machining) Hardness < 88HRA Hardness ≥ 88HRA 0,20 0,20 0,15 0,15 0,10 0,10 0,05 0,05 0 0,05 0,10 0,15 0,15 0 0,05 0,10 0,15 0,15 Feed Rate f (mm/rev) Feed Rate f (mm/rev) Recommended Cutting Conditions (Carbide Machining) Coolant: Dry Min. - Optimum - Max. Work Material Cutting Conditions Classification Hardness (HRA) SEH Grade Cutting Speed vc (m/min) Feed Rate f (mm/rev) Depth of Cut ap (mm/rev) VMVC 706050 83 ~ 87 G7G6 5 - 20 - 30 0,03 - 0,10 - 0,20 0,03 - 0,10 - 0,20 VMVC 40 ≥ 88 G5G2 5 - 15 - 30 0,03 - 0,05 - 0,07 0,03 - 0,10 - 0,20 B10