PCD (Polycrystalline Diamond)

SUMIDIA Binderless Series uses nano-polycrystalline diamond for the

cutting edge and demonstrates excellent wear and fracture resistance

compared to conventional sintered diamond tools.

In particular, SUMIDIA Binderless Series allows for improvements in tool

life and machining precision that go far beyond conventional diamond

tools in the machining of hard brittle materials, such as carbide.

Excellent for High Precision Machining of Carbide

Nano-polycrystalline diamond with excellent wear resistance achieves high

precision machining of carbide.

Maintains Superior Dimensional Tolerances Over Many Hours

Greatly reduces the number of tool replacemets compared to conventional

diamond tools and increases work efficiency while reducing total costs.

Suitable for Hard Brittle Material Machining

Hard brittle materials (such as ceramics) that could only be ground before

can now be cut.

Characteristics

Comparison of Structure Hardness

Nano-Polycrystalline Diamond Conventional PCD SEM Structure SEM Structure Nano-Polycrystalline Diamond No anisotropy and ultra-hard Single-crystal Diamond Hardness depends on face orientation

Conventional PCD Load 4,9N

0 50 100 150

Diamond ParticlesKnoop Hardness (GPa) Diamond Particles
(30 ~ 50nm)(1 ~ 10μm)
Application (Carbide Machining)
Hardness < 88HRAHardness ≥ 88HRA
0,200,20
0,150,15
0,100,10
0,050,05

0 0,05 0,10 0,15 0,15 0 0,05 0,10 0,15 0,15

Feed Rate f (mm/rev) Feed Rate f (mm/rev) Recommended Cutting Conditions (Carbide Machining) Coolant: Dry Min. - Optimum - Max.

Work MaterialCutting Conditions
ClassifiicationHardness (HRA)SEH GradeCutting Speed vc(m/min)Feed Rate f (mm/rev)Depth of Cut ap(mm/rev)
VM VC70 60 5083 ~ 87G7 G65 -20- 300,03 -0,10- 0,200,03 -0,10- 0,20
VM VC40≥ 88G5 G25 -15- 300,03 -0,05- 0,070,03 -0,10- 0,20