
Material Properties ■ Material Properties Thermal Linear-Thermal Hardness (mHv) Young Modulus Melting Point Material Specific Gravity Conductivity Expansion Coefficient (GPa) (GPa) (°C) (W/m·°C) (X 10-6/°C) Insert Grades Tungsten Carbide WC 15.6 21 690 126 5.1 2,900 Titanium Carbide TiC 4.94 31 450 17 7.6 3,200 Tantalum Carbide TaC 14.5 18 280 21 6.6 3,800 Niobium Carbide NbC 8.2 20 340 17 6.8 3,500 Titanium Nitrate Aluminum Oxide TiN Al2O3 5.43 3.98 20 29 260 410 29 29 9.2 8.5 2,950 2,050 A Silicon Nitride Si3N4 3.17 25 310 29 3.0 >1,900 (decomposes) Cubic Boron Nitride cBN 3.48 44 700 1,300 4.7 — Diamond C 3.52 >90 970 2,100 3.1 — Cobalt Co 8.9 — 100 to 180 69 12.3 1,495 Nickel Ni 8.9 — 200 92 13.3 1,455 WC-5% Co 15.0 18 630 79 5.0 — Cemented WC-10% Co 14.6 14 580 75 5.0 — Carbide WC-20% Co 13.5 10 530 67 6.0 — High Speed Steel 8.7 8 210 17 11.0 — A37